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Aruna Manoharan

Aruna Manoharan

RF Packaging R&D Engineer at Intel Corp.

Chandler, Arizona

Dedicated and self-motivated. Experienced microelectronics packaging R&D Engineer with background in Polymers and Nano materials.

Areas of Interest and expertise:
• Microelectronics packaging • Advanced Material Characterization & Analysis – CSAM/SEM/ FIB/ Auger/ X-Ray • Sample prep - Cross sectioning & FIB • Die attach and material dispensing • Statistical analysis – JMP/Minitab • Numerical • MethodsMechanical behaviour and material testing - DMA/ DSC/ TGA/ FT IR • Polymer chemistry & Rheology • Speciality elastomers • Process economics & Industrial management • Polymer Processing Technology • Polymer Product Design – AutoCAD/ SolidWorks

Founder & Webcomic Illustrator for "Frizzy Missy Comics"


Experience:

  • RF Packaging Engineer (NXP Semiconductors)
  • RF Packaging R&D Engineer (Intel Corporation)
  • RF Packaging Engineer (Freescale Semiconductor)
  • Event Coordinator (MUAD- MU After Dark, Arizona State University)
  • Subject Tutor (Student Success Center)

Skills:

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