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Ohad Brandelstein

Ohad Brandelstein

Digital core lead for 5G mmWave RFIC at Intel Corporation


13 years of experience in VLSI, ASIC & FPGA, implementation and verification.
Leading digital core for 5G RF Integrated circuits from requirements definitions through Tape Out and Lab Silicon bring up.
Full chip flow experience from spec, design, integration, verification, Synthesis, DFT
Cross-cultural understanding.
Very strong language skills.
Self-motivated and Independent.
Team player – Excellent interpersonal organizational and communications skills.
Result oriented.


  • Hardware (ASIC design) student (Oplus Technologies LTD.)
  • Logic Core Lead - 5G mmWave RFIC (Intel Corporation)
  • Logic Design Engineer (Oplus (TM) an Intel company)
  • Logic Design Engineer (Intel (Mobile Wireless Group))


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Dipl.-Ing. "Petroleum Engineering", MScEcon "Petroleum, Energy Economics & Finance" @ Russian Federation